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Interview With Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology Inc.
Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology, explores the role of power packaging in shaping the design and performance of power modules used across industries, including automotive, aerospace, and industrial systems.
Nitesh highlights key aspects of power packaging, including thermal management, parasitic effects, integration, and compliance with industry standards, and stresses how these issues are often underestimated until they become design challenges.
The discussion…
Website: microchipis.podbean.com
